|Left: Filled vias on ceramic before thin film metalization.
Via diameter is 125 microns.|
Right: Cross section of vias through ceramic. Ceramic thickness is 500 microns.
|Patterned thin film gold on both sides of ceramic substrate.|
|Cross section of step in jumper made with two perpendicular cuts of a 4 mil blade, July 2, 1998. This requires a special fixture to stand jumpers on end for the second cut.|
|Reject jumper with test polyimide cover. Rectangular cutout in cover partially exposes bonding pads. Definition of edges of cutout needs improvement. Polyimide thickness is 4 microns.|
|Detail of top side of production jumper. White area is step. Gold is darker where covered by passivation. Traces are 13 microns with 11 micron spaces.|
|Detail of bottom side of production jumper. Gold is darker where covered by passivation. Traces are 13 microns with 11 micron spaces.|