To my best knowledge, wafer 80 has been annealed for 40 min. at 400 degrees C.

Changes in die classification after annealing:

good -> fair :  11 die ( die # 2, 15, 19, 44, 60, 82, 83, 95, 107, 122, 128 )
good -> bad :  18 ( # 3, 23, 33, 34, 50, 59, 61, 67, 99, 100, 115, 116, 117, 119, 124, 132, 133, 134 )
fair -> good :  0
fair -> bad :    10 ( # 31, 36, 51, 66, 81, 92, 106, 109, 127, 129 )
bad -> good :  1 ( # 1 )
bad -> fair :    1 ( # 74 )
No change :    93

Die quality before annealing, after annealing

Pipeline quality map before annealing, after annealing

Map of die failures before annealing, after annealing

Map of random bad cells before annealing, after annealing