Wafer 82 had been annealed at 150 degrees C for two weeks. The wafer was probed in the middle and at the end of the annealing.

Changes in die classification after 2 weeks:

good -> fair :  0 die
good -> bad :  1 ( die # 123 )
fair -> good :  2 ( # 24, 111 )
fair -> bad :    1 ( # 127 )
bad -> good :  3 ( # 2, 13, 17 )
bad -> fair :    0
No change :    127

Die quality before annealing, annealed for 1 week, annealed for 2 weeks

Pipeline quality map before annealing, annealed for 1 week, annealed for 2 weeks

Map of die failures before annealing, annealed for 1 week, annealed for 2 weeks

Map of random bad cells before annealing, annealed for 1 week, annealed for 2 weeks