Quality maps for the second batch of radiation hard SVX3D chips from Honeywell

Click on the wafer number to get its quality map in Postscript
 
 Wafer # 
 Manufacturer # 
 Good die yield (%) 
 Good+fair die yield (%) 
22
21316-03-04
63.5
76.9
23
21316-06-05
53.8
82.7
24
21316-03-07
55.8
73.1
25
21316-03-05
55.8
61.5
26
21316-03-22
67.3
78.8
27
21316-03-21
76.9
84.6
28
21316-06-11
46.2
57.7
29
21316-06-12
57.7
67.3
30
21316-06-13
53.8
69.2
31
21316-06-14
67.3
76.9
32
21316-06-15
36.5
38.5
33
21316-06-16
57.7
67.3
34
21316-03-02
69.2
76.9
35
21316-03-06
17.3
23.1
36
21316-03-23
51.9
65.4
37
21316-03-12
61.5
76.9
38
21316-03-10
51.9
75.0
39
21316-03-09
71.2
71.2
40
21316-03-16
76.9
86.5
41
21316-03-24
32.7
34.6
42
21316-03-03
69.2
80.8
43
21316-03-18
28.8
38.5
44
21316-03-17
48.1
53.8
45
21316-06-20
65.4
82.7
46
21316-06-19
57.7
82.7
47
21316-06-10
42.3
44.2
48
21316-06-08
55.8
61.5
49
21316-06-04
32.7
38.5
50
21316-06-18
48.1
57.7
51
21316-06-02
38.5
48.1
52
21316-06-03
15.4
32.7
53
21316-06-06
55.8
76.9
54
21316-06-01
28.8
32.7
55
21316-06-07
44.2
63.5
56
21316-06-17
17.3
23.1
57
21316-06-09
34.6
50.0
58
21316-07-13
50.0
73.1
59
21316-07-01
55.8
63.5
60
21316-07-15
50.0
63.5
61
21316-07-04
57.7
71.2
62
21316-07-02
61.5
75.0
63
21316-07-05
36.5
46.2
64
21316-07-08
61.5
76.9
65
21316-07-09
42.3
59.6
66
21316-07-07
51.9
71.2
67
21316-07-16
67.3
80.8
68
21316-04-09
63.5
86.5
71
21316-04-07
61.5
80.8
73
21316-04-10
67.3
82.7
75
21316-04-04
40.4
44.2
77
21316-04-12
46.2
57.7
78
21316-04-02
61.5
73.1
79
21316-04-11
34.6
48.1
84
21316-04-01
57.7
73.1
86
21316-04-05
61.5
71.2
88
21316-04-08
21.2
28.8
90
21316-04-03
38.5
51.9
94
21316-04-06
57.7
59.6
95
21316-05-11
34.6
51.9
96
21316-05-12
40.4
44.2
97
21316-05-22
55.8
76.9
98
21316-05-21
48.1
63.5
99
21316-05-05
53.8
82.7
100
21316-05-06
50.0
59.6
101
21316-05-08
44.2
57.7
102
21316-05-14
40.4
42.3
103
21316-05-17
46.2
69.2
104
21316-05-10
63.5
65.4
105
21316-05-15
75.0
84.6
106
21316-07-20
34.6
51.9
107
21316-07-10
13.5
51.9
108
21316-07-14
51.9
69.2
109
21316-07-17
50.0
76.9
110
21316-07-18
50.0
67.3
111
21316-07-19
44.2
55.8
112
21316-07-06
46.2
55.8
113
21316-07-03
57.7
61.5
114
21316-07-11
75.0
86.5
115
21316-07-12
78.8
82.7
116
21316-04-23
53.8
63.5
117
21316-04-24
57.7
65.4
118
21316-04-21
55.8
57.7
119
21316-04-22
57.7
73.1
120
21316-04-19
36.5
48.1
121
21316-04-16
57.7
67.3
122
21316-04-13
42.3
50.0
123
21316-04-17
59.6
69.2
124
21316-04-15
65.4
75.0
125
21316-04-20
61.5
65.4
126
21316-04-18
42.3
50.0
127
21316-05-18
38.5
42.3
128
21316-05-16
53.8
63.5
129
21316-05-03
23.1
28.8
130
21316-05-04
42.3
50.0
131
21316-05-13
65.4
78.8
132
21316-05-02
32.7
48.1
133
21316-05-07
46.2
59.6
134
21316-05-01
51.9
67.3
135
21316-05-19
51.9
53.8
136
21316-05-09
59.6
67.3

The total number of wafers in this batch is 100. The combined yield of good dies in the batch is 50.6 %. The combined yield of good and fair dies is 62.5 %.


Questions? E-mail to igv@lbl.gov