Click on letters in the "Maps" column to get various wafer maps in Postscript:
A -- standard wafer quality map
B -- map of die failure types
C -- pipeline quality map
D -- map of "random" bad pipeline cells

The following wafers have been probed before backgrinding and backplating:

Wafer #	Manufacturer #	Good die yield (%)	Good+fair yield (%)	Maps
74*	Y21316-09-03	29.9	46.3	A, B, C, D
76	Y21316-12-04	44.8	55.2	A, B, C, D
80*	Y21316-12-15	17.9	30.6	A, B, C, D
82*	Y21316-12-11	41.0	47.8	A, B, C, D
92**	Y21316-09-02	41.0	56.0	A, B, C, D
93	Y21316-09-05	63.4	71.6	A, B, C, D
137	Y21316-12-12	44.0	59.7	A, B, C, D
147*	Y21316-12-14	39.6	49.3	A, B, C, D

* -- Yield and maps after annealing

** -- This wafer has been diced without backgrinding for studies of via failures

The average yield of good dice for wafers from lots 9 and 12 is 39.7 %. The combined yield of good and fair dice is 53.3 %.