Good Hybrid Criteria

(rev. 10/11/99)

(1) Number of bad channels N or fewer, where N is the number of chips.

  • No more than 2 bad channels in any chip.
  • At most 1 per HYBRID for L0s assembled after 10/10/99.
  • (2) Number of random bad pipeline capacitors at most 30 per chip.

  • At most 30 per HYBRID for L0s assembled after 10/10/99.
  • (3) All tests are passed with BIAS RATIO SELECT = 1.

    (4) No bad cell-IDs across all channles in a chip.

    (5) Median current consumption 90mA/chip for AVDD and 20mA/chip for DVDD.

  • As measured by the LBNL burn-in setup.
  • (6) Fixes for hybrid opens: 2 or fewer (3 for L3-phi and L4).

  • Only wirebonds and soldered discrete wires allowed in the fix.
  • Opens in ISLOPE resistor pad to be addressed by moving resistor to spare component pad, and not counted as fixes.
  • (7) Fixes for cable opens: at most 1.

  • Fix must use soldered and tacked down wire.
  • (8) Fixes for hybrid shorts: at most 1.

  • Fix cannot involve glued-on extra components.