The Error made on the dielectric 2 print consists of covering up areas that should have exposed Metal 2. These areas are the ground pads that the SVX3 chips attach to.

The fix adopted consists of re-printing the chip pads on Metal 3, leaving the original chip pads burried, un-used but connected to ground.

The Fix carries a material and thermal penalty that has been calculated. The extra material is the un-used, burried metal, which will increase the total radiation length of the hybrid by a factor of 1.06 to 1.08. The thermal penalty has been calculated to increase the hybrid temperature by approximately 0.2 degrees C and the temperature of the SVX3 chip itself by an additional 0.2 C.

The fix also involved miling 12 openings for vias in the erroneous dielectric already printed. These openings have been milled with a Yag laser at Applied Laser Technology successfully (3/8/99).