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Left: Filled vias on ceramic before thin film metalization. Via diameter is 125 microns.
Right: Cross section of vias through ceramic. Ceramic thickness is 500 microns.

Patterned thin film gold on both sides of ceramic substrate.

Cross section of step in jumper made with two perpendicular cuts of a 4 mil blade, July 2, 1998. This requires a special fixture to stand jumpers on end for the second cut.

Reject jumper with test polyimide cover. Rectangular cutout in cover partially exposes bonding pads. Definition of edges of cutout needs improvement. Polyimide thickness is 4 microns.

Detail of top side of production jumper. White area is step. Gold is darker where covered by passivation. Traces are 13 microns with 11 micron spaces.

Detail of bottom side of production jumper. Gold is darker where covered by passivation. Traces are 13 microns with 11 micron spaces.

	Left: Filled vias on ceramic before thin film metalization. Via diameter is 125 microns. Right: Cross section of vias through ceramic. Ceramic thickness is 500 microns.
	Patterned thin film gold on both sides of ceramic substrate.
	Cross section of step in jumper made with two perpendicular cuts of a 4 mil blade, July 2, 1998. This requires a special fixture to stand jumpers on end for the second cut.
	Reject jumper with test polyimide cover. Rectangular cutout in cover partially exposes bonding pads. Definition of edges of cutout needs improvement. Polyimide thickness is 4 microns.
	Detail of top side of production jumper. White area is step. Gold is darker where covered by passivation. Traces are 13 microns with 11 micron spaces.
	Detail of bottom side of production jumper. Gold is darker where covered by passivation. Traces are 13 microns with 11 micron spaces.