Notes on Re-Probed Die Plot --------------------------- All the die in this plot tested good or fair in wafer probing, and were re-probed after the wafer was diced. Shown is the total number of die up to the end ef each week (i.e. cumulative). The colors are perched one on top of another (stacked) so the number of die in a particular condition is the width of the corresponding color band. The maximum height of the light blue (i.e. the sum of the widths of all the color bands) is the total number of die reprobed. Die that tested good on hybrids can be delayed in time by up to two weeks, because they are assigned the date that the hybrid they are on was last tested. Thus if a hybrid has a bad die or other problem that requires re-work, the good die for that hybrid may shift to a later week. This has no effect on the total level of the plot, only on the distribution of the colors.