Click on the wafer number in the table below to get its map of die failures in Postscript. Standard 6-in wafer quality maps are here.
In the maps below failure types are color coded. As in the wafer quality maps, green and yellow mean good and fair dies, correspondingly. Other colors signify various die failure modes. The failures are categorized as follows:
Currents : AVDD or DVDD supply currents are too high.
Serial : serial line failures.
Basic readout : incorrect
readback structure. Bad chip id, invalid channel number sequence,
etc.
Pipeline logic : failures
in the pipeline logic. Unexpected cell ids in various operation modes.
Analog : a wide class of failures
which include out-of-range pedestals, gains, noise, etc.
Operator : die is classified
as bad by an operator of the wafer probing setup. This may happen
when the classification program encounters a failure pattern which is either
unusual or could be due to wafer misalignment. In such a case the operator
may perform an interactive test of the die functionality.
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