Quality maps for the first batch of radiation hard SVX3D chips from Honeywell

Click on the wafer number to get its quality map in Postscript

 Wafer # 
 Manufacturer # 
 Good die yield (%) 
 Good+fair die yield (%) 
7
21316-02-14
51.9
59.6
8
21316-02-15
78.8
84.6
9
21316-02-11
50.0
59.6
10
21316-02-16
34.6
48.1
11
21316-02-01
28.8
42.3
12
21316-02-02
50.0
59.6
13
21316-02-05
51.9
65.4
14
21316-02-19
53.8
61.5
15
21316-02-13
55.8
59.6
16
21316-02-12
59.6
75.0
17
21316-02-17
42.3
50.0
18
21316-02-03
57.7
61.5
19
21316-02-08
47.7
59.1
20
21316-02-10
34.2
44.7
139
21316-02-18
40.4
50.0
148
21316-02-04
51.9
76.9
149
21316-02-06
61.5
67.3
150
21316-02-20
46.2
50.0

The total yield of good dies in the batch is 50.1 %. The combined yield of good and fair dies is 60.0 %.

Questions? E-mail to igv@lbl.gov