Click on the wafer number to get its quality map in Postscript
 

Wafer #	Manufacturer #	Good die yield (%)	Good+fair die yield (%)
22	21316-03-04	63.5	76.9
23	21316-06-05	53.8	82.7
24	21316-03-07	55.8	73.1
25	21316-03-05	55.8	61.5
26	21316-03-22	67.3	78.8
27	21316-03-21	76.9	84.6
28	21316-06-11	46.2	57.7
29	21316-06-12	57.7	67.3
30	21316-06-13	53.8	69.2
31	21316-06-14	67.3	76.9
32	21316-06-15	36.5	38.5
33	21316-06-16	57.7	67.3
34	21316-03-02	69.2	76.9
35	21316-03-06	17.3	23.1
36	21316-03-23	51.9	65.4
37	21316-03-12	61.5	76.9
38	21316-03-10	51.9	75.0
39	21316-03-09	71.2	71.2
40	21316-03-16	76.9	86.5
41	21316-03-24	32.7	34.6
42	21316-03-03	69.2	80.8
43	21316-03-18	28.8	38.5
44	21316-03-17	48.1	53.8
45	21316-06-20	65.4	82.7
46	21316-06-19	57.7	82.7
47	21316-06-10	42.3	44.2
48	21316-06-08	55.8	61.5
49	21316-06-04	32.7	38.5
50	21316-06-18	48.1	57.7
51	21316-06-02	38.5	48.1
52	21316-06-03	15.4	32.7
53	21316-06-06	55.8	76.9
54	21316-06-01	28.8	32.7
55	21316-06-07	44.2	63.5
56	21316-06-17	17.3	23.1
57	21316-06-09	34.6	50.0
58	21316-07-13	50.0	73.1
59	21316-07-01	55.8	63.5
60	21316-07-15	50.0	63.5
61	21316-07-04	57.7	71.2
62	21316-07-02	61.5	75.0
63	21316-07-05	36.5	46.2
64	21316-07-08	61.5	76.9
65	21316-07-09	42.3	59.6
66	21316-07-07	51.9	71.2
67	21316-07-16	67.3	80.8
68	21316-04-09	63.5	86.5
71	21316-04-07	61.5	80.8
73	21316-04-10	67.3	82.7
75	21316-04-04	40.4	44.2
77	21316-04-12	46.2	57.7
78	21316-04-02	61.5	73.1
79	21316-04-11	34.6	48.1
84	21316-04-01	57.7	73.1
86	21316-04-05	61.5	71.2
88	21316-04-08	21.2	28.8
90	21316-04-03	38.5	51.9
94	21316-04-06	57.7	59.6
95	21316-05-11	34.6	51.9
96	21316-05-12	40.4	44.2
97	21316-05-22	55.8	76.9
98	21316-05-21	48.1	63.5
99	21316-05-05	53.8	82.7
100	21316-05-06	50.0	59.6
101	21316-05-08	44.2	57.7
102	21316-05-14	40.4	42.3
103	21316-05-17	46.2	69.2
104	21316-05-10	63.5	65.4
105	21316-05-15	75.0	84.6
106	21316-07-20	34.6	51.9
107	21316-07-10	13.5	51.9
108	21316-07-14	51.9	69.2
109	21316-07-17	50.0	76.9
110	21316-07-18	50.0	67.3
111	21316-07-19	44.2	55.8
112	21316-07-06	46.2	55.8
113	21316-07-03	57.7	61.5
114	21316-07-11	75.0	86.5
115	21316-07-12	78.8	82.7
116	21316-04-23	53.8	63.5
117	21316-04-24	57.7	65.4
118	21316-04-21	55.8	57.7
119	21316-04-22	57.7	73.1
120	21316-04-19	36.5	48.1
121	21316-04-16	57.7	67.3
122	21316-04-13	42.3	50.0
123	21316-04-17	59.6	69.2
124	21316-04-15	65.4	75.0
125	21316-04-20	61.5	65.4
126	21316-04-18	42.3	50.0
127	21316-05-18	38.5	42.3
128	21316-05-16	53.8	63.5
129	21316-05-03	23.1	28.8
130	21316-05-04	42.3	50.0
131	21316-05-13	65.4	78.8
132	21316-05-02	32.7	48.1
133	21316-05-07	46.2	59.6
134	21316-05-01	51.9	67.3
135	21316-05-19	51.9	53.8
136	21316-05-09	59.6	67.3

The total number of wafers in this batch is 100. The combined yield of good dies in the batch is 50.6 %. The combined yield of good and fair dies is 62.5 %.