Maps for 6-in SVX3D wafers from lot 8

Click on letters in the "Maps" column to get various wafer maps in Postscript:
A -- standard wafer quality map
B -- map of die failure types
C -- pipeline quality map
D -- map of "random" bad pipeline cells

 Wafer # 
 Manufacturer # 
 Good die yield (%) 
 Good+fair yield (%) 
    Maps    
70
Y21316-08-03
12.1
23.6
A, B, C, D
85
Y21316-08-04
61.4
70.7
A, B, C, D
87
Y21316-08-01
55.0
62.9
A, B, C, D
140*
Y21316-08-17
31.4
56.4
A, B, C, D
141
Y21316-08-06
57.1
65.7
A, B, C, D
142
Y21316-08-11
37.1
52.9
A, B, C, D
143
Y21316-08-15
60.0
67.1
A, B, C, D
151
Y21316-08-13
57.9
65.0
A, B, C, D
152
Y21316-08-12
50.0
58.6
A, B, C, D
153
Y21316-08-08
48.6
57.1
A, B, C, D
154
Y21316-08-05
33.6
42.1
A, B, C, D
155
Y21316-08-20
39.3
51.4
A, B, C, D
156
Y21316-08-16
32.1
43.6
A, B, C, D
157
Y21316-08-18
27.1
33.6
A, B, C, D
158
Y21316-08-14
43.6
54.3
A, B, C, D
159
Y21316-08-10
32.9
44.3
A, B, C, D
160
Y21316-08-07
49.3
55.0
A, B, C, D
161
Y21316-08-19
33.6
45.7
A, B, C, D

* -- This wafer was not backgrinded and backplated because it was used for annealing studies. The yield numbers and maps are determined after annealing.

The average yield of good dice in the above sample is 42.3 %. The combined yield of good and fair dice is 52.8 %.

"Late" lot 8 wafers

 Wafer # 
 Manufacturer # 
 Good die yield (%) 
 Good+fair yield (%) 
    Maps    
247
Y21316-08-09
48.6
68.6
A, B, C, D
248
Y21316-08-02
27.1
33.6
A, B, C, D


Questions? E-mail to igv@lbl.gov