Jumper development done at the UC Berkeley Microlab.
Flowchart of jumper fabrication sequence
Yield per plate and per month and of jumpers shipped to FNAL.
Cross sections of un-filled vias, through center and along edge. (both on same page) Parts have been sputtered with 1um nominal of gold, then etched, and finally coated with polyimide passivation. The meniscus seen inside the vias is polyimide. The average via dimater is 120 microns.
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